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Innovative Application of Automatic Fire Suppression Material in Adhesives: Synergistic Effect of Improving Fire Safety and Bonding Performance

Innovative Application of Automatic Fire Suppression Material in Adhesives: Synergistic Effect of Improving Fire Safety and Bonding Performance   This article deeply explores the application of automatic fire suppression materials in adhesives. It expounds on the importance and working principles of automatic fire suppression materials in fire safety systems, and analyzes...

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The Influence of Epoxy Resin Encapsulation on the Heat Dissipation Performance of LEDs and the Hazards of Poor Heat Dissipation

The Influence of Epoxy Resin Encapsulation on the Heat Dissipation Performance of LEDs and the Hazards of Poor Heat Dissipation   LED (Light Emitting Diode), as a new type of high-efficiency, energy-saving, and environmentally friendly light source, has been widely used in fields such as lighting and display. However, with the...

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Methods for Ensuring Uniform Encapsulation of LED Chips with Epoxy Resin, Process Difficulties and Solutions

Methods for Ensuring Uniform Encapsulation of LED Chips with Epoxy Resin, Process Difficulties and Solutions   With the rapid development of LED technology, it has been widely used in many fields such as lighting, display, automotive electronics, etc. Epoxy resin, as a commonly used encapsulation material for LEDs, has good optical,...