Description
Product Specification Parameters
| Product Model |
Product Name |
Color |
Typical Viscosity (cps) |
Curing Time |
Use |
Distinction |
| DM-6128 |
Low temperature curing epoxy adhesive |
Black |
7000-27000 |
@80℃ 20min
60℃ 60min |
CCD/CMOS/Sensitive Electronic Components |
Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable for low temperature curing and can provide good adhesion to various materials in a fairly short period of time. Typical applications include memory cards, CCD/CMOS assemblies. Particularly suitable for thermal components that require low temperature curing. |
| DM-6129 |
Low temperature curing epoxy adhesive |
Black |
12,000-46,000 |
@80℃ 5~10min |
CCD/CMOS/Sensitive Electronic Components |
It is a one-component heat-curing epoxy resin. It is suitable for low temperature curing and has good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermally sensitive components where low curing temperatures are required. |
| DM-6220 |
Low temperature curing epoxy adhesive |
Black |
2500 |
@80℃ 5~10min |
Backlight module fixing |
Classic low temperature curing adhesive for LCD backlight module assembly. |
| DM-6280 |
Low temperature curing epoxy adhesive |
White |
8700 |
@80℃ 2min |
CCD or CMOS components, VCM motor fixing |
Low temperature fast curing for assembly of CCD or CMOS components, VCM motors. 3280 is designed for thermal applications requiring low temperature curing. It can quickly provide customers with high throughput applications , such as laminating light diffusion lenses to leds, and assembling image sensing devices (including camera modules). This material is white to provide greater reflectivity. |
Product Features
| Good adhesion |
High production efficiency (fast curing) |
| Fast delivery of high throughput applications |
Suitable for low temperature curing applications |
Product Advantages
Low temperature curing adhesive is a single component heat curing epoxy resin. It is fast curing at low temperature and is used for the assembly of CCD or CMOS components and VCM motors. This product is suitable for low temperature curing and has good adhesion to a wide range of materials in a very short period of time. It is especially suitable for thermal components where low temperature curing is required.
