glue provider for the electronics productions.
Epoxy Based Conductive Silver Adhesive
DeepMaterial Conductive silver adhesive is a one-component modified epoxy/silicone adhesive developed for the integrated circuit packaging and LED new light sources, flexible circuit board (FPC) industries. After curing, the product has high electric conductivity, heat conduction, high temperature resistance and other high reliable perfor- mance. The product is suitable for high-speed dispensing, dispensing good type protection, no deformation, no collapse, no diffusion; The cured material is resistant to moisture, heat and high temperature. Can be used for crystal packaging, chip packaging, LED solid crystal bonding, low temperature welding, FPC shielding and other purposes.
Conductive Silver Adhesive Product Selection
| Product line | Product Name | Product Typical Application |
| Conductive Silver Adhesive | DM-7110 | Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle. |
| DM-7130 | Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent adhesive output speed, and improves production cycle time. When used in the LED packaging industry, the dead light rate is low, the yield rate is high, the light decay is good, and the degumming rate is extremely low. | |
| DM-7180 | Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle. |
Conductive Silver Adhesive Product Data Sheet
| Product line | Product Series | Product Name | Colour | Typical Viscosity (cps) | Curing Time | Curing Method | Volume Resistivity(Ω.cm) | TG/°C | Store /°C/M |
| Epoxy based | Conductive Silver Adhesive | DM-7110 | Silver | 10000 | @175°C 60min | Heat curing | 〈2.0×10-4 | 115 | -40/6M |
| DM-7130 | Silver | 12000 | @175°C 60min | Heat curing | 〈5.0×10-5 | 120 | -40/6M | ||
| DM-7180 | Silver | 8000 | @80°C 60min | Heat curing | 〈8.0×10-5 | 110 | -40/6M |
