glue provider for the electronics productions.
Epoxy-Based Chip Underfill And COB Encapsulation Materials
DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. DeepMaterial provides formulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for reuse of the board.
Flip chip assembly requires stress relief of the welding seam again for extended thermal aging and cycle life. CSP or BGA assembly requires the use of an underfill to improve the mechanical integrity of the assembly during flex, vibration or drop testing.
DeepMaterial’s flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler levels, selected for the glass transition temperature and modulus for the intended application.
COB encapsulant can be used for wire bonding to provide environmental protection and increase mechanical strength. The protective sealing of wire-bonded chips includes top encapsulation, cofferdam, and gap filling. Adhe- sives with fine-tuning flow function are required, because their flow ability must ensure that the wires are encapsulat- ed, and the adhesive will not flow out of the chip, and ensure that can be used for very fine pitch leads.
DeepMaterial’s COB encapsulating adhesives can be thermally or UV cured DeepMaterial’s COB encapsulation adhesive can be heat cured or UV-cured with high reliability and low thermal swelling coefficient, as well as high glass conversion temperatures and low ion content. DeepMaterial’s COB encapsulating adhesives protect leads and plumbum, chrome and silicon wafers from the external environment, mechanical damage and corrosion.
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy, UV-curing acrylic, or silicone chemistries for good electrical insulation. DeepMaterial COB encapsulating adhesives offer good high temperature stability and thermal shock resistance, electrical insulating properties over a wide temperature range, and low shrinkage, low stress, and chemical resistance when cured.
Deepmaterial is best top waterproof structural adhesive glue for plastic to metal and glass manufacturer,supply non conductive epoxy adhesive sealant glue for underfill pcb electronic components,semiconductor adhesives for electronic assembly,low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material and so on
DeepMaterial Epoxy Resin Base Chip Bottom Filling And Cob Packaging Material Selection Table
Low Temperature Curing Epoxy Adhesive Product Selection
| Product Series | Product name | Product typical application |
| Low temperature curing adhesive | DM-6108 |
Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable for low-temperature curing and can have good adhesion to various materials in a relatively short time. Typical applications include memory cards, CCD/CMOS components. It is especially suitable for the occasions where the heat-sensitive element needs to be cured at a low temperature. |
| DM-6109 |
It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical applications include memory card, CCD/CMOS assembly. It is especially suitable for applications where low curing temperature is required for heat-sensitive components. |
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| DM-6120 |
Classic low-temperature curing adhesive, used for LCD backlight module assembly. |
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| DM-6180 |
Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light diffusion lenses to LEDs, and assembling image sensing equipment (including camera modules). This material is white to provide greater reflectivity. |
Encapsulation Epoxy Product Selection
| Product line | Product Series | Product Name | Colour | Typical viscosity (cps) | Initial fixation time / full fixation | Curing method | TG/°C | Hardness /D | Store/°C/M |
| Epoxy based | Encapsulation Adhesive | DM-6216 | Black | 58000-62000 | 150°C 20min | Heat curing | 126 | 86 | 2-8/6M |
| DM-6261 | Black | 32500-50000 | 140°C 3H | Heat curing | 125 | * | 2-8/6M | ||
| DM-6258 | Black | 50000 | 120°C 12min | Heat curing | 140 | 90 | -40/6M | ||
| DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Heat curing | 137 | 90 | 2-8/6M |
Underfill Epoxy Product Selection
| Product Series | Product name | Product typical application |
| Underfill | DM-6307 | It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. |
| DM-6303 | One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA. | |
| DM-6309 | It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25μm clearance, minimize induced stress, improve temperature cycling performance, with excellent chemical resistance. | |
| DM- 6308 | Classic underfill, ultra-low viscosity suitable for most underfill applications. | |
| DM-6310 | The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material has excellent mechanical properties and can protect solder joints during thermal cycling. | |
| DM-6320 | The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has a higher glass transition temperature and higher fracture toughness, and can provide good protection for solder joints during thermal cycling. |
DeepMaterial Epoxy Based Chip Underfill And COB Packaging Material Data Sheet
Low Temperature Curing Epoxy Adhesive Product Data Sheet
| Product line | Product Series | Product Name | Colour | Typical viscosity (cps) | Initial fixation time / full fixation | Curing method | TG/°C | Hardness /D | Store/°C/M |
| Epoxy based | Low temperature curing encapsulant | DM-6108 | Black | 7000-27000 | 80°C 20min 60°C 60min | Heat curing | 45 | 88 | -20/6M |
| DM-6109 | Black | 12000-46000 | 80°C 5-10min | Heat curing | 35 | 88A | -20/6M | ||
| DM-6120 | Black | 2500 | 80°C 5-10min | Heat curing | 26 | 79 | -20/6M | ||
| DM-6180 | White | 8700 | 80°C 2min | Heat curing | 54 | 80 | -40/6M |
Encapsulated Epoxy Adhesive Product Data Sheet
| Product line | Product Series | Product Name | Colour | Typical viscosity (cps) | Initial fixation time / full fixation | Curing method | TG/°C | Hardness /D | Store/°C/M |
| Epoxy based | Encapsulation Adhesive | DM-6216 | Black | 58000-62000 | 150°C 20min | Heat curing | 126 | 86 | 2-8/6M |
| DM-6261 | Black | 32500-50000 | 140°C 3H | Heat curing | 125 | * | 2-8/6M | ||
| DM-6258 | Black | 50000 | 120°C 12min | Heat curing | 140 | 90 | -40/6M | ||
| DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Heat curing | 137 | 90 | 2-8/6M |
Underfill Epoxy Adhesive Product Data Sheet
| Product line | Product Series | Product Name | Colour | Typical viscosity (cps) | Initial fixation time / full fixation | Curing method | TG/°C | Hardness /D | Store/°C/M |
| Epoxy based | Underfill | DM-6307 | Black | 2000-4500 | 120°C 5min 100°C 10min | Heat curing | 85 | 88 | 2-8/6M |
| DM-6303 | Opaque creamy yellow liquid | 3000-6000 | 100°C 30min 120°C 15min 150°C 10min | Heat curing | 69 | 86 | 2-8/6M | ||
| DM-6309 | Black liquid | 3500-7000 | 165°C 3min 150°C 5min | Heat curing | 110 | 88 | 2-8/6M | ||
| DM-6308 | Black liquid | 360 | 130°C 8min 150°C 5min | Heat curing | 113 | * | -20/6M | ||
| DM-6310 | Black liquid | 394 | 130°C 8min | Heat curing | 102 | * | -20/6M | ||
| DM-6320 | Black liquid | 340 | 130°C 10min 150°C 5min 160°C 3min | Heat curing | 134 | * | -20/6M |
