Case In USA: American Partner’s Chip Underfill Solution
As a high-tech country, there are lots of BGA, CSP or Flip Chip devices companies in USA, so the underfill adhesives are in great demand.
One of our clients from USA high-tech companies, they use the DeepMaterial underfill solution for their chip underfill, and it’s perfect working.
DeepMaterial offers high performing materials for Sintering and Die Attach, Surface Mount, and Wave Soldering applications. The breadth of products includes Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills and Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, and Stencils.
DeepMaterial Chip Underfill Adhesive series are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. These epoxy based materials can be dispensed on the edges of the BGA, CSP or Flip Chip devices. This material will subsequently flow to fill the space beneath these components.
Such as it contains a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
It is a high glass transition temperature [Tg] and low coefficient thermal expansion [CTE] underfill. These features result in a high reliability solution.
Product Features
· Provides full component coverage when dispensed onto the substrate preheated at 70 – 100°C
· High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
· Excellent Thermal Cycling Test performance
· Halogen-free and complies with RoHS Directive 2015/863/EU
Underfill For Exceptional Thermal Fatigue Resistance
Stand alone SAC solder joints in BGA and CSP assemblies tend to falter in thermally harsh automotive applications. High Tg and low CTE underfill [UF] is a reinforcement solution. As rework is not a requirement, this allows higher filler content in the formulation to develop such attributes.
DeepMaterial Chip Underfill Adhesive series has a high Tg of 165°C and low CTE1/CTE2 of 31 ppm/105 ppm, on assembled and has been tested to pass 5000 cycles -40 +125°C thermal cycling test. For a better flow rate, preheat the substrates during dispensing.
We’sre also looking for DeepMaterial industrial adhesive products cooperation global partners, if you want to be an agent of DeepMaterial’s:
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……
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