Bluetooth Headset Bonding Adhesive Glue
Bluetooth Headset Application of DeepMaterial Adhesive Products
The earphone bonding process is strict and the demand is large;
deepmaterial is adhesive sealing solution for bluetooth headset manufacturers and lectronics bonding adhesive glue solutions for consumer electronics commponent suppliers, supply microelectronic adhesives,hybrid microelectronic semiconductor die attached adhesives,adhesives for microelectronic assembly,adhesive bonding in microelectronics and photonics and so on.
DeepMaterial series adhesive products can meet the needs of different application points.
DeepMaterial
Dust Net Bonding
Product: DM6751
Features: High strength, good weather resistance, fast assembly
DeepMaterial
Magnet Bonding
Product: DM6030
Features: High strength, good weather resistance, fast assembly
DeepMaterial
Control Board Encapsulation
Product: DM6496
Features: High strength, UV moisture dual curing
DeepMaterial
Shell Bonding
Product: DM6751
Features: High strength, good weather resistance, fast assembly
DeepMaterial
SPK Bonding
Product: DM6030
Features: High strength, good weather resistance, fast assembly
DeepMaterial
Charging Box Bonding
Product: DM6542
Features: High initial strength, Impact resistant, quick assembly
DeepMaterial
Headphone Shell Bonding
Product: DM6751
Features: High strength, good weather resistance, fast assembly
DeepMaterial
Charging Box Shell Bonding
Product: DM6751
Features: High strength, good weather resistance, fast assembly
