DeepMaterial top encapsulation

Electronic devices and computers are now ubiquitous in consumer and industrial settings. As more types of boards and chips are exposed to different types of environments, delicate packages require new methods to protect them from environmental and physical stresses. DeepMaterial provides an excellent way to protect chips at an...

Hot melt adhesives(HMAS) VS hot melt pressure sensitive adhesives(HMPSAS)

Hot melt adhesives (HMAs) and hot melt pressure sensitive adhesives (HMPSAs) have been widely used in manufacturing for over 40 years. Almost every industry including packaging, bookbinding, woodworking, hygiene, construction, automotive, electronics, shoemaking, textile lamination, product assembly, tapes and labels use hot melt adhesives extensively. What are these materials? HMA...

Epoxy Resins for Semiconductor Packaging Assemblies

Resolve Moisure and Heat Challenges The performance of a semiconductor depends greatly upon the strength of its packaging assembly. Without a durable, reliable and efficient packaging assembly, the semiconductor is susceptible to corrosion, heat, moisture and physical impact as well as weakened connections to external circuits. To ensure the protection of...