Epoxy-Encapsulant-

Epoxy Encapsulant

The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.

Category:

Description

Product Specification Parameters

Product

Model

 Product

Name

 Color Typical

Viscosity (cps)

 Curing time Use Distinction
DM-6016E Epoxy potting adhesive Black 58000~62000 @ 150℃ 20min PCB board sensitive inserts, transistors, smart card IC

card packaging

 For applications where excellent handling properties are required. Cured materials exist for severe thermal shock and provide continuous heat resistance to 177°C. Particularly suitable for the packaging of transistors and similar semiconductors, can be used for the packaging of watch integrated circuits, component encapsulation adhesive, for PCB board sensitive inserts, transistors, smart card IC card packaging.
DM-6058E Epoxy potting adhesive Black 50,000 @ 120℃ 12min Packaging of

sensors and

precision

components

 This product provides excellent environmental and thermal protection for packaging components, and is especially suitable for the protection of sensors and precision components used in harsh environments such as automobiles.
DM-6061E Epoxy potting adhesive Black 32500~50000 @ 140°C 3H PCB board sensitive inserts, transistors, smart card IC

card packaging

 Component encapsulation glue, used for packaging sensitive plug-in PCB boards, excellent viscosity stability, easy to control the size of the glue. After passing 1000H temperature/humidity/deviation test and thermal cycle to 125℃. The special viscosity stabilized at 25°C provides a more easily controlled size using conventional time/pressure dispensing equipment.
DM-6086E Epoxy potting adhesive Black 62500 @ 120℃ 30min 150℃ 15min IC and Semiconductor Packaging Used in applications requiring excellent handling properties. For IC and semiconductor packaging with good heat cycle capability, material can withstand thermal shock continuously up to 177°C

Product Features
· Provides superior environmental and thermal protection
· Excellent viscosity stability, easy to control dispensing size
· Good thermal cycling capability, material can withstand thermal shock up to 177°C continuously
· For applications requiring superior processing performance

Product Advantages
The product is an epoxy resin encapsulant, suitable for applications requiring excellent handling properties. Component encapsulation glue, used for PCB board sensitive plug-in packaging, excellent viscosity stability, easy to control the size of the glue. Epoxy resin encapsulants are designed for applications that require excellent handling properties. Used for IC and semiconductor packaging, it has good heat cycle capability, and the material can withstand thermal shock continuously to 177°C.